| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a substrate to effectively remove surface coarseness generated around a circumferential part or the like of the substrate and a film adhering to the circumferential part or the like of the substrate and becoming a source of contaminant, in a manufacturing step of a semiconductor apparatus or the like. SOLUTION: A bevel part and an edge part of the substrate are polished with a polishing film 22 after a CMP step. Projections and depressions of the bevel part are measured by applying set shape and set intensity of light from a normal direction to a device forming surface of the substrate onto a part of the substrate bevel part where a polishing head is not positioned and by measuring dispersed light, thus a finishing point of the polishing is detected based on the measurement. COPYRIGHT: (C)2008,JPO&INPIT |
