| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a substrate for improving a yield of semiconductor device, in which an electron element is formed on the surface of the substrate. SOLUTION: A projection part formation step for forming a projection part on a rear side face of the substrate, and an electron element forming step for forming the electron element on the surface of the substrate while the substrate is supported by the projection part are included in a process for forming the semiconductor device, in which the electron element is formed on the surface of the substrate. COPYRIGHT: (C)2008,JPO&INPIT
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