发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of reducing the number of components and absorbing the thermal expansion of a substrate. SOLUTION: The wiring board 10 is constituted of mechanically sticking a first substrate 20 having a permanent magnet 25A mounted on the first substrate 20 so as to be opposed to a second substrate 30 and electrically connected to a first terminal 21; and the second substrate 30 having permanent magnet 35A mounted on the second substrate 30, so as to be opposed to the permanent magnet 25A mounted on the first substrate 20 and electrically connected to a second terminal 31. When the first substrate 20 is stuck to the second substrate 30, the permanent magnets 25A, 35A are mutually stuck in close by magnetic force and the first terminal 21 and the second terminal 31 are electrically connected to each other. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008042028(A) 申请公布日期 2008.02.21
申请号 JP20060216097 申请日期 2006.08.08
申请人 ADVANTEST CORP 发明人 KINOSHITA SEIZO;SHIMAZAKI NOBUAKI;KUITANI TETSUYA;IWAMOTO YUICHIRO
分类号 H05K1/14;G01R31/28;H01L21/66;H05K1/02 主分类号 H05K1/14
代理机构 代理人
主权项
地址