| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit formation substrate with largely improved reliability in electric connection, high density, and excellent quality by means of an interlayer connection means employing conductive paste or the like. SOLUTION: A manufacturing method of the circuit formation substrate includes a sticking step of sticking a filmlike material to a substrate material, wherein a direction of a material flow during the manufacture of the substrate material is approximately parallel to a direction of a material flow during the manufacture of the circuit formation substrate, and a variation is reduced in thickness of the substrate material after the sticking step. This method can provide a high quality and high density circuit formation substrate. COPYRIGHT: (C)2008,JPO&INPIT
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