| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy adhesive giving high long-term adhesive force while effectively suppressing the increase in residual stress associated with the difference of coefficient of thermal expansion between a metallic part and an epoxy resin in cooling, to provide a cast-molded product using the epoxy adhesive, and to provide a method for using the epoxy adhesive. SOLUTION: The epoxy adhesive comprises a main component comprising an epoxy compound having in one molecule at least two epoxy groups and rubber particles smaller than 1μm in primary size and an epoxy-curing agent incorporated in the main component. COPYRIGHT: (C)2008,JPO&INPIT
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