MODULE FOR AUTOMATED MATRIX REMOVAL IN ACIDIC PLATING SOLUTIONS

摘要

In accordance with the present invention, an organic additive is characterized in the presence of an acidic metal plating matrix in a metal plating solution by: providing a sample from the metal plating solution; activating a metal-complexing resin with a weak acid to provide an activated metal-complexing resin; eluting the sample through the activated metal-complexing resin to form a treated sample in which a concentration of the acidic metal plating matrix is reduced; and determining a concentration of an organic additive in the metal plating solution by analyzing the treated sample.