PHOTORESIST APPLICATION METHOD, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED AND METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE, AND THE PIEZOELECTRIC VIBRATING REED AND THE PIEZOELECTRIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photoresist application method for uniformly so as to apply a photoresist on the corner parts of a wafer substrate (10) formed with ruggedness or a through-hole.

SOLUTION: The photoresist application method has a charging step (S1241) of charging a substrate (10) including a first side and a second side, either to a positive pole or to a negative pole; a photoresist powder application step (S1242) of applying photoresist powder charged to the other of the positive pole and the negative pole onto the first side and the second side; a dissolving step (S1245) of dissolving the photoresist powder by spraying a solvent gas for dissolving the photoresist powder over a photo-sensitive agent powder applied on the substrate; and a photoresist curing step (S1246) of making the dissolved photoresist powder cured.

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