| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for sticking a wafer to a ring frame through an adhesive tape for support and holding it without breaking it even though the wafer is thinned, and to provide a holding structure. <P>SOLUTION: On the outer periphery of the back surface of a semiconductor wafer W, an annular projection is formed and remains so as to surround a flat recess formed by a backgrinding. The back surface side of the semiconductor wafer W is pressurized to the adhesive surface of the adhesive tape for the support stuck to the ring frame f to stick the annular projection to the adhesive tape for the support. Also, the adhesive tape for the support is pressurized and deformed from the side of a non-adhesive surface, and is pushed and stuck to the flat recess on the back surface of the wafer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
