发明名称 CARBON WIRING STRUCTURE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve structural stability of carbon wiring applied to LSI and to improve compatibility with a surface flattening processing in an LSI process. SOLUTION: An LSI carbon wiring structure is provided with a first conductor (11) and a second conductor (13) positioning through an interlayer insulating film, and carbon wiring (20) which is electrically connected to the first conductor and the second conductor. Carbon wiring comprises a plurality of carbon fibers (21) extending between the first conductor and the second conductor, and a resin layer (22) with which a part between the carbon fibers is filled. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008041954(A) 申请公布日期 2008.02.21
申请号 JP20060214727 申请日期 2006.08.07
申请人 FUJITSU LTD 发明人 SHIOTANI HIROKI;NIHEI MIZUHISA
分类号 H01L21/768;H01L21/28;H01L21/285 主分类号 H01L21/768
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