发明名称 Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheet
摘要 <p>The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 µm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 µm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.</p>
申请公布号 EP1889887(A1) 申请公布日期 2008.02.20
申请号 EP20070015793 申请日期 2007.08.10
申请人 NITTO DENKO CORPORATION 发明人 HIRAYAMA, TAKAMASA;KIUCHI, KAZUYUKI;SATO, MASAAKI;ARIMITSU, YUKIO;SHIMOKAWA, DAISUKE;KISHIMOTO, TOMOKO
分类号 C09J7/00 主分类号 C09J7/00
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