| 摘要 |
A semiconductor device and a fabricating method thereof are provided to disperse the stress that is generated at a boundary part of an end part of sealing resin and a wiring board. A sealing resin(42-1) is provided on a wiring board(41). Inside the sealing resin, a semiconductor device is mounted on the wiring board by a die bonding member, and the semiconductor element is connected to the wiring board via bonding wires. A reinforcing resin(42-2) is provided along a boundary part of the wiring board and the sealing resin so that the boundary part is reinforced. Since the reinforcing resin is provided along the perimeter of the external circumferential part of the sealing resin, the boundary part of the wiring board and the sealing resin is reinforced in a uniform manner along the perimeter of the external circumferential part of the sealing resin. |
