| 摘要 |
A dummy for cleaning a semiconductor mold is provided to prevent an epoxy mold compound from being leaked outwardly by forming mesh lines on upper and lower surfaces of the dummy in a lattice pattern. A dummy includes a board(11) made of an epoxy resin, copper layers(12a,12b) formed on upper and lower portions of the board, and a molding layer made of an epoxy molding compound. Mesh lines(15a,15b) formed in a lattice pattern at a predetermined interval are on an edge of the upper and lower surfaces of the dummy on which the molding layer is formed. Defining grooves(13a,13b) are formed on the upper and lower surfaces of the dummy, so that the dummy is defined into plural blocks. The defining grooves are formed on the upper and lower surfaces in the same pattern.
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