| 摘要 |
<p>A substrate processing apparatus is provided to reduce an overload of a pressure adjusting pump by installing the pump in a process solution recovery pipe. Plural rotation shafts(204) are rotatably disposed in a chamber(202) in which flat substrates are processed. Plural rollers(206) are engaged to the rotation shafts to support the substrates, and are rotated with the rotation shafts. A process solution supplier(240) supplies a process solution onto the substrate supported by the rollers. The process solution supplier has a storage container(248), a nozzle pipe(246) disposed adjacently to the substrate, a process liquid supply pipe(242) connecting the nozzle pipe with the storage container, a process solution recovery pipe(244), a pump(250) installed in the process solution supply pipe, and a pressure sensor(256) is installed between the nozzle pipe and the valve.</p> |
