METHOD OF MANUFACTURING A MOLDING STRUCTURE AND METHOD AND APPARATUS FOR MOLDING A SUBSTRATE USING THE MOLDING STRUCTURE

摘要

A method for manufacturing a molding structure and a method and an apparatus for molding a substrate are provided to shorten a time required for a molding process by forming the molding structure used in molding of the substrate prior to a substrate molding process. A first release film is attached to an upper portion of a lower mold(S110), and then powder of an epoxy molding compound is applied on the first release film(S120). A second release film is attached to a bottom surface of an upper mold opposite to the lower mold(S130), and then the power is pressed by using the upper and lower molds to form a flat EMC(Epoxy Molding Compound)(S140). The upper and lower molds are detached with the first release film attached to the flat EMC, thereby forming a molding structure composed of the flat EMC and the first release film(S150).