Prealignment and gapping for RF substrates

摘要

A method is provided for manufacturing electronic module assemblies comprising a plurality of substrates and a housing. The method comprises providing an alignment plate having a plurality of protrusions disposed through an upper surface thereof, wherein the protrusions are positioned on the alignment plate according to a predetermined substrate layout pattern; positioning the substrates on the alignment plate in between respective ones of the protrusions such that repeatable gaps may be created between the substrates; applying strips of tape over common edges of the substrates to form a sheet of substrates; removing the sheet from the alignment plate; trimming excess tape from the sheet; cleaning the housing and sheet; placing an epoxy preform within the housing; placing the sheet of substrates onto the preform while aligning key artwork from the sheet to housing walls, pins or tabs integrally formed within the housing; securing the sheet of substrates within the housing using spot tape; vacuum curing the module assembly; and removing the tape from the module assembly.