发明名称 Semiconductor power device with charge compensation structure and monolithic integrated circuit, and method for fabricating it
摘要 The invention relates to a semiconductor power device with charge compensation structure and monolithic integrated circuit, and method for fabricating it. In the case of this semiconductor power device, zones ( 6 ) in charge compensation cells ( 27 ) that are arranged vertically and doped complimentarily to the semiconductor chip volume ( 5 ) are arranged in the entire chip volume, the complimentarily doped zones ( 6 ) extending right into surface regions ( 11 ) of the semiconductor power elements ( 7 ) and not projecting into surface regions ( 12 ) of semiconductor surface elements ( 1 ).
申请公布号 US7332788(B2) 申请公布日期 2008.02.19
申请号 US20040927270 申请日期 2004.08.26
申请人 INFINEON TECHNOLOGIES AG 发明人 AHLERS DIRK;MARION MIGUEL CUADRON;WAHL UWE;WILLMEROTH ARMIN
分类号 H01L29/00;H01L21/336;H01L27/088;H01L29/06;H01L29/76;H01L29/78 主分类号 H01L29/00
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