| 摘要 |
A heat sink apparatus of a communication device and a method for producing the same are provided to effectively discharge heat without increasing the number of heat sink via holes or a cross sectional area of the via hole to discharge heat of the communication device. A heat sink apparatus of a communication device comprises a copper foil, a plurality of heat sink via holes(147), and heat sink patterns(161). Communication devices(119,121) are mounted on an upper layer of a substrate(111) of the copper foil. The plurality of via holes are formed from the copper foil to a bottom surface of the substrate. The heat sink patterns connect the plurality of heat sink via holes formed on the bottom surface of the substrate. A region of the heat sink patterns is larger than that of the copper foil having mounted communication devices. The heat sink patterns are formed in a heat sink plate shape.
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