发明名称 Liquid cooling system and electronic equipment using the same
摘要 For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which joins them, are constructed as an external module, and the external module is mounted externally and fixed to a housing of the electronic equipment. Cooling liquid is circulated by the pump through the heat receiving jacket, the radiator, and the tank to achieve cooling.
申请公布号 US7333334(B2) 申请公布日期 2008.02.19
申请号 US20040012118 申请日期 2004.12.16
申请人 HITACHI, LTD. 发明人 YAMATANI TAKAAKI;ASANO ICHIRO;IDE JUNYA;TONO SUMIHIRO;TAKEUCHI TSUNENORI
分类号 F25D17/02;H05K7/20;F25D9/00;F28F7/00;H01B9/06;H01L23/473;H05K5/00 主分类号 F25D17/02
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