OPTICAL PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREFORE

摘要

An optical printed circuit board and its fabricating method are provided to improve optical interconnection by reducing a gap between a clad layer and a photo diode of a transmission chip or VCSEL(Vertical-Cavity Surface-Emitting Laser) of a receiving chip. A method for fabricating an optical printed circuit board comprises the steps of: forming holes on a metal foil; laminating a lower clad layer(15) for filling the holes, wherein the lower clad layer has an optical interconnection bump(17); forming the optical interconnection bump by laminating the lower clad layer; laminating a core layer(19) on the low clad layer, wherein the core layer is positioned inside an upper clad layer(29); forming first and second reflective layers(21,23) in the core layer corresponding to each position of the holes; laminating the upper clad layer on the lower clad layer; and forming a circuit pattern(27) on the metal foil.