| 发明名称 |
Systems and methods for wafer bonding by localized induction heating |
| 摘要 |
A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
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| 申请公布号 |
US7332411(B2) |
申请公布日期 |
2008.02.19 |
| 申请号 |
US20040917123 |
申请日期 |
2004.08.12 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, LP |
发明人 |
MCKINNELL JAMES;CHEN CHIEN-HUA;LIEBESKIND JOHN;HELLEKSON RONALD A |
| 分类号 |
H01L21/46;H01L21/00;H01L21/30;H01L21/48;H01L21/50;H01L21/762 |
主分类号 |
H01L21/46 |
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