发明名称 Chip components feeding apparatus
摘要 A chip components feeding apparatus is provided to be able to lessen a push load applied to a leading electronic part from succeeding electronic chip component to favorably take out the leading electronic part even in the case where a residual pressure phenomenon occurs in a conveyance passage. Since a chip component conveyance tube is provided with an ascending portion, in which an air flow based on an action of negative pressure causes electronic chip component to move climbing against dead weight, it is possible to restrict a pushing force applied to electronic chip component forwardly from those electronic chip component in the ascending portion, which are acted by dead weight, to lessen a push load applied to a leading electronic part by succeeding electronic chip component even in the case where a residual pressure phenomenon occurs in a conveyance passage including a chip component conveyance tube when the action of negative pressure is released.
申请公布号 US7331442(B2) 申请公布日期 2008.02.19
申请号 US20050239955 申请日期 2005.09.29
申请人 TAIYO YUDEN CO., LTD. 发明人 SAITO KOJI
分类号 H05K13/02 主分类号 H05K13/02
代理机构 代理人
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