发明名称 Resin-molded component and method for manufacturing thereof as well as diaphragm for loudspeaker
摘要 A resin-molded component such as a loudspeaker diaphragm, in which rigidity is enhanced while light weight and high specific modulus of elasticity are maintained, is formed by applying carbon dioxide gas with a predetermined pressure to a thermoplastic resin in which crystallization is facilitated in the resin flowing direction to fill a mold. After the resin is filled, injection molding is performed by somewhat moving the mold to form five layers of: oriented minute-foaming layers, having approximately cylindrical foams, the length of which is twice the diameter thereof in the resin flowing direction in the mold, an unfoamed core layer positioned between both the foaming layers, and unfoamed skin layers formed on the front and rear surfaces.
申请公布号 US7332215(B2) 申请公布日期 2008.02.19
申请号 US20040860739 申请日期 2004.06.03
申请人 SONY CORPORATION 发明人 TOKURA KUNIHIKO;URYU MASARU
分类号 B32B5/20;H04R7/02;B32B5/18;B32B27/06;H04R7/10;H04R7/12;H04R31/00 主分类号 B32B5/20
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