| 摘要 |
An apparatus for removing impurities in a plating solution is provided to optionally remove impurities remained in the plating solution within a short time, regenerate a resin such that the plating solution can be reused, promptly remove impurities without men, and make it possible to solve problems caused by contamination generated during the precious metal plating operation, and a method for removing impurities in a plating solution using the apparatus is provided. An apparatus for removing impurities in a plating solution comprises: a control panel on which a plurality of operation switches and a plurality of instrument boards are installed; a cylindrical resin tank(3); an upper cap(4) connected to an upper part of the resin tank; a lower cap(5) connected to a lower part of the resin tank; safety nets(10,12) installed between the upper and lower caps and upper and lower ends of the resin tank; first to fourth solenoid valves(17-20) for controlling a flow of the plating solution such that the plating solution performs a direct motion or retrograde motion; a circulation pump(16) for pressing the plating solution to circulate the plating solution; a filtration filter(21) for filtering the plating solution; a pressure gauge(41) for measuring pressure of a flowing plating solution; and a pH measuring auxiliary tank(22) for collecting and discharging a resin cleaning solution. The upper cap has a resin injection pipe(7) installed on the center of a top face thereof such that a resin inflow valve(14) is formed on the resin injection pipe, and an upper pipe(6) installed on one side of the top face thereof. The lower cap has a resin discharge pipe(9) installed on the center of a bottom face thereof. The pH measuring auxiliary tank is connected to a plating solution discharge pipe(23) and has a pH measuring sensor(24) installed on an upper part thereof and a discharge valve(25) installed on a lower part thereof.
|
