| 摘要 |
In one embodiment, a via structure for a printed circuit board is provided which includes a signal via and an elongated signal conductor strip in electrical connection with the signal via. The elongated signal conductor strip is adjacent to a ground conductor and extends from the conductive pad substantially to the ground conductor. The elongated signal conductor strip includes a portion extending laterally outward, which may be configured to have a capacitance so as to establish an impedance for the via structure. |
