| 摘要 |
A semiconductor chip module is provided for mounting many optical waveguide elements at high density in the vicinity of a semiconductor chip (for instance, LSI), while suppressing cost low, making high-speed modulation possible, and for performing optical interconnection with a low latency (low delay). In the semiconductor chip module, a transmission optical waveguide element (3) mounted in the vicinity of a side plane of a semiconductor chip (2) on a circuit board (1) is provided with an input light waveguide into which light from an external light source enters; an output light waveguide, which is arranged at a position shifted in a direction vertical to a front plane of the circuit board from the input light waveguide, while being mounted on the circuit board, and outputs an optical signal to other devices; an optical path switching structure for guiding the light guided by the input light waveguide to the output light waveguide; and an optical modulator, which is arranged in the input light waveguide or the output light waveguide and modulates the light from the external light source based on an electric signal from the semiconductor chip. |
