| 摘要 |
A conductive paste, which has a plate-like conductive filler having a 99% cumulative particle diameter of 25mum or less and a binder resin as essential components, is characterized in that the plate-like conductive filler is a metal powdery material provided with an alloy layer of silver and copper on the surface. The conductive paste exhibits excellent conductivity and via hole filling characteristics by being partially fused with a copper foil circuit, i.e. an object to be connected, when connecting the copper foil circuit with heat and pressure, and provides a multilayer printed wiring board having a high connecting reliability and excellent interlayer connecting characteristics. |
