LASER PROCESSING APPARATUS AND METHOD USING BEAM SPLIT

摘要

An apparatus and a method for laser processing using laser beam split are provided to improve processing efficiency of the wafer by removing a low dielectric material remained between the edge parts after removing edge parts of a low dielectric material on a region to be removed of the wafer using laser beam when processing a wafer on which a dielectric material is formed. A laser processing apparatus includes: a control part(110) for controlling the entire operation of the apparatus; a laser generating unit(120) for outputting a laser beam with a designated aperture; a beam splitting unit(130) for splitting a laser beam projected from the laser generating unit into two laser beams; a mirror drive part(140) for driving the mirror; an input part(150) for inputting control parameters and control instructions; an output part(160) for indicating information such as an operating state; a storage part(170) for storing data; a mirror(10) for reflecting laser beams projected from the beam splitting unit onto a surface of a workpiece(14) having a low dielectric material formed on an upper portion thereof; and an optical system(12) for condensing the laser beams reflected from the mirror or converting shape of the condensed laser beam to irradiate split laser beams onto edge parts of the low dielectric material on a region to be removed of the workpiece. The workpiece having the low dielectric material formed thereon is placed on a stage(16), and the stage is moved in the designated direction by a transfer unit(18).