A UNIT AND METHOD FOR TRANSFERRING SUBSTRATES, AND AN APPARATUS AND METHOD FOR TREATING SUBSTRATES WITH THE UNIT

摘要

A substrate transfer unit is provided to improve the transfer efficiency of wafers by using a substrate transfer unit capable of being changed into a folding state and an unfolding state. A substrate is placed on a blade member(120). An arm member(140) transfers the blade member, coupled to the blade member. A driving member supplies driving force to the blade member or the arm member. The blade member includes a lower blade(120b) and an upper blade(120a) on the lower blade wherein the relative position of the upper blade with respect to the lower blade can vary. Each one of the lower and upper blades includes a first support part(122) on which a substrate is placed, a second support part(124) on which a substrate is placed, and a connection part(126) for connecting the first support part with the second support part. The upper and lower blades are changed from a folding state to an unfolding state and vice versa wherein the upper blade is vertically positioned on the lower blade in the folding state and the upper and lower blades are rotated from the folding state by a predetermined angle in mutually opposite directions.