发明名称 |
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD |
摘要 |
A plasma processing apparatus is disclosed which enables to conduct a preferable plasma processing while suppressing damage to an object to be processed which is caused by plasma generation. The plasma processing apparatus comprises at least a plasma processing chamber wherein a plasma process is performed on an object to be processed, an object-holding means for placing the object within the plasma processing chamber and a plasma generating means for generating a plasma in the plasma processing chamber, and the plasma generating means can be intermittently supplied with energy.
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申请公布号 |
KR20080015056(A) |
申请公布日期 |
2008.02.15 |
申请号 |
KR20087002170 |
申请日期 |
2008.01.25 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
NOZAWA TOSHIHISA;ISHIBASHI KIYOTAKA;NAKANISHI TOSHIO |
分类号 |
H01J37/32;H01L21/02;H01L21/3065;H01L21/31 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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