| 摘要 |
A method for producing printed circuit board sets capable of being made, among other things, without adhesive, in flexible manner and with very small transverse connections with diameters of the order of 1 to 3 mum. The method uses, as starting material for the printed circuit board set, a support element free of any copper layer. The through holes, in particular for the smallest transverse connection, are made by spraying heavy ions into the obtained material. Only subsequently the surface of the support element are coated with a copper film. The electrical transverse connections are thus simultaneously produced. If the support element is, for example, flexible polyimide and it has not been pretreated for the copper plating, it is possible to use the heavy ion process not only to produce the holes, but also to make the surface rough. The desired printed circuit board set is then completed according to the usual methods. |
