| 摘要 |
The semiconductor device includes tub 5 that is smaller than semiconductor chip 8 , and which supports semiconductor chip 8 ; molded section 12 that is formed by resin-molding around semiconductor chip 8 ; suspension leads 4 , including supporting portions 4 a that support tub 5 and exposed portions 4 b that are connected to supporting portions 4 a and are exposed on back surface 12 a of molded section 12 , and are elevation processed in supporting portions 4 a; leads 2 that are located around tub 5 ; and wires 10 that connect pads 7 of the semiconductor chip 8 with the corresponding leads 2 ; wherein the thickness of tub 5 and supporting portions 4 a of suspension leads 4 is less than the thickness of exposed portions 4 b, and back surface 8 b of semiconductor chip 8 is firmly in contact with molding resin 11. |
