| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To remove a trouble caused by projection of an electronic component packaged on a board. <P>SOLUTION: The package includes a pipe for circulating fluid inside; a chip type heating element 4 fixed onto the circumferential surface of the pipe 2, for heating the fluid in the pipe 2; and a chip type temperature sensor pair 6, 8 fixed to each position at an equal distance on the upstream side and on the downstream side of the heating element 4 on the surface of the pipe 2, and constituted separately from the heating element 4. Each projection part on the opposite side to the fixed side of the pipe 2 of the heating element 4 and the temperature sensor pair 6, 8 is stored in a recess 14 of a printed wiring board 12, and the heating element 4 and the temperature sensor pair 6, 8 are fixed to the printed wiring board 12 by connecting each terminal thereof to a wiring layer on the printed wiring board 12. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
