| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface-mount crystal device that blocks electrical short circuiting, while properly maintaining vibration characteristics and sealing by an eutectic alloy. SOLUTION: In the manufacturing method of the surface-mount type crystal device wherein at least a crystal chip is contained in the rectangular recessed package body, the aperture end face of which has an annular Au film and electrically and mechanically connected to crystal support terminals provided at one end side in the recessed package body, a metallic cover at least the outer circumference of which includes an annular Au film is jointed with the aperture end face of the recessed package body by an eutectic alloy that contains Au; and the metallic cover is electrically connected to a ground mount terminal provided at a bottom side of the recessed package body by a conductive path in a vertical direction exposed in a frame wall inner circumference of the recessed package body, the coating amount of the eutectic alloy applied to an outer circumference of the metallic cover or each corner, at the aperture end face of the package body, is reduced for middle regions of each side and the eutectic alloy is heated and molten. COPYRIGHT: (C)2008,JPO&INPIT
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