发明名称 Intelligent cooling method combining passive and active cooling components
摘要 A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.
申请公布号 US2008036076(A1) 申请公布日期 2008.02.14
申请号 US20060502696 申请日期 2006.08.11
申请人 SUN MICROSYSTEMS, INC. 发明人 OUYANG CHIEN
分类号 H01L23/34 主分类号 H01L23/34
代理机构 代理人
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