发明名称 THERMAL PROCESSING SYSTEM WITH IMPROVED PROCESS GAS FLOW AND METHOD FOR INJECTING A PROCESS GAS INTO A THERMAL PROCESSING SYSTEM
摘要 A thermal processing system with improved gas flow and method for injecting a process gas into a thermal processing system. The thermal processing system has an injection section with injection outlets that inject process gas into a processing space and a delivery section that delivers process gas to the injection section. The delivery section may be coupled with the injection section at an inlet disposed between opposite ends of the injection section. A fluid lumen of the injection section may have a larger cross-sectional area than a fluid lumen of the delivery section. The thermal processing system may include an inner tube, which surrounds the processing space, having a slit through which the processing space communicates with an annular pumping space defined between the inner tube and an outer tube of the thermal processing system.
申请公布号 US2008035055(A1) 申请公布日期 2008.02.14
申请号 US20060463180 申请日期 2006.08.08
申请人 TOKYO ELECTRON LIMITED 发明人 DIP ANTHONY;ASARI SHINJI;GANDHI MEENAKSHISUNDARAM
分类号 C23C16/00 主分类号 C23C16/00
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