PHOTOSENSITIVE POLYIMIDE COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND FPC

摘要

A photosensitive polyimide composition comprising a soluble polyimide resin which is a condensate of an aromatic tetracarboxylic dianhydride with diamines, a positive-acting photosensitizer, and a solvent in which the resin and photosensitizer are dissolved, the photosensitive polyimide composition having a pyridine content of 0.05 wt.% or lower. The photosensitive polyimide composition may be one in which the diamines comprise a siliconediamine and a hydroxylated diamine and the soluble polyimide resin has a weight-average molecular weight of 20,000-50,000 and a molecular-weight distribution which has one peak and a dispersity ratio of 2.0 or less. The positive photosensitive resin composition comprises a solvent-soluble heat-resistant resin which is a soluble polyimide resin or soluble polyamide-imide resin, a positive-acting photosensitizer, a heat-curing agent, and a solvent, and is characterized in that the heat-curing agent is a melamine-type curing agent.