METHOD OF FORMING AN ELECTRONIC COMPONENT

摘要

A method of forming a component for use in printed electronics. The method comprises the steps of preparing a plurality of discrete deposition locations (20a, 20b, 20c) on a substrate (2), and depositing first and second components, such as light emitting polymers (24a, 24b), by fluid-processing on the discrete deposition locations. The fluid- processing comprises the steps of : supplying the first component (24a) in a fluid; contacting the fluid containing the first component with the deposition locations, attracting at least a proportion of the first component to a selected deposition location; removing fluid and any unfixed first component; supplying the second component (24b) in a fluid,- contacting the fluid containing the second component with the deposition locations,- attracting at least a proportion of the second component to a selected deposition location, for example by dielectrophoresis; and removing fluid and any unfixed second component.