BOARD PROCESSING METHOD, PROGRAM, PROGRAM READABLE RECORDING MEDIUM, AND BOARD PROCESSING SYSTEM

摘要

PROBLEM TO BE SOLVED: To finally form a pattern at optional size when patterns are formed by conducting exposure treatment plural times between resist film formation and development.

SOLUTION: A wafer with a resist film is conveyed to an exposure apparatus to be exposed (Q2). Then, the wafer is exposed and baked in a second processing system (Q3). It is conveyed again to the exposure apparatus for exposure (Q4). The second exposed wafer is conveyed to a first processing system to be exposed and baked again (Q5). A period from the completion of exposure to the start of baking after exposure is controlled to be the same for the first and second processings.

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