| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a copper-clad laminated plate having excellent adhesive strength imparted between a copper foil and a polyimide resin layer through plasma treatment. SOLUTION: The manufacturing method of the metal-clad laminated plate comprises subjecting the surface side layer of a polyimide film, which is represented by general formula (1) (wherein R<SB>1</SB>indicates a divalent organic group represented by formula (2), R<SB>2</SB>indicates a tetravalent organic group, R<SB>3</SB>s indicate each independently CH<SB>3</SB>, C<SB>2</SB>H<SB>5</SB>, OCH<SB>3</SB>or OC<SB>2</SB>H<SB>5</SB>, and R<SB>4</SB>indicates H, CH<SB>3</SB>, C<SB>2</SB>H<SB>5</SB>, OCH<SB>3</SB>or OC<SB>2</SB>H<SB>5</SB>) to plasma treatment and providing the treated surface with a metal layer. COPYRIGHT: (C)2008,JPO&INPIT |
