Solder head for applying and/or filling out medium on and/or into a carrier for soldering, moves, pulsates, oscillates and/or vibrates the medium and/or the holder with secondary movement and/or frequency towards its longitudinal direction

摘要

The solder head for applying and/or filling out a medium on and/or into a carrier for soldering, partially moves, pulsates, oscillates and/or vibrates the medium and/or a holder for the carrier with secondary movement and/or frequency towards its longitudinal direction during the application and filling. The primary movement is overlaid contingent through the filling and/or drawing. The arrangement pulsates and/or vibrates with limited movement energy to obtain a better warm transition in contact the solder head with the carrier during soldering the head by the carrier material. The solder head for applying and/or filling out a medium on and/or into a carrier for soldering, partially moves, pulsates, oscillates and/or vibrates the medium and/or a holder for the carrier with secondary movement and/or frequency towards its longitudinal direction during the application and filling. The primary movement is overlaid contingent through the application and/or filling. The solder head pulsates and/or vibrates with limited movement energy to obtain a better warm transition in contact the solder head with the carrier during soldering the head by the carrier material. The secondary movement is carried out continuously or during the application and/or soldering. The solder head is formed so that an accelerated withdrawal movement is carried out during soldering. The direction of the secondary movement of the solder head is implemented towards its longitudinal direction during the contacts with the carrier in a plain parallel to the carrier and/or in a horizontal plain and during soldering. The secondary movement and/or the frequency of the arrangement is set the medium and/or the holder to or approximately on the corresponding characteristic resonance frequency. The frequency is selected such a way that an optimal consequence is reached in one or several given parameters like medium viscosity, -quantity, -density, -weight, withdrawing surface etc. The area of the secondary frequency lies between 0.01-5 MHz. The secondary movement and/or the frequency is carried out and/or stimulated through sound and/or waves caused by vibration. The secondary movement and/or the frequency is differently selected during the application and during the soldering of the carrier and/or the medium. The exaltation and/or the absorption in solder bath or other fluids or powders enables the partial application and/or partial wetting. The secondary movement and/or the frequency of the solder head pulsates and/or moves sinusoidal, rectangular and/or in a saw tooth-form. Independent claims are included for: (1) procedure for applying and/or filling out a medium on and/or into a carrier for soldering; and (2) system or a component like computer program for moving a solder head and for applying and/or filling out a medium on and/or into a carrier.