| 摘要 |
Power electronics include a printed circuit board on which at least one component to be cooled is mounted, and a heat sink which is arranged on that side of the printed circuit board which faces the component to be cooled. The heat sink is in thermally conductive contact with the component to be cooled. In order to allow the power electronics to be produced and assembled easily, they furthermore have a positioning device for positioning the printed circuit board in a defined orientation relative to the heat sink, where the distance between the heat sink and the printed circuit board corresponds approximately to the physical height of the at least one component to be cooled, and at least one attachment element for attaching the printed circuit board to the heat sink and at the same time for pressing the at least one component to be cooled against the heat sink. |
