| 摘要 |
PROBLEM TO BE SOLVED: To stabilize a connection of a microscopic bump for electric connection to reduce its manufacturing cost. SOLUTION: A method for forming the bump for electric connection comprises the steps of forming a plurality of bump original forms on a substrate, depositing a protective film with an upper part of the bump original forms exposed, and acuminating the bump original forms by ion trimming corners of the uppper part of the plurality of bump original forms exposed from the protective film. COPYRIGHT: (C)2008,JPO&INPIT
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