发明名称 WIRING CIRCUIT BOARD ARRANGEMENT SHEET CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board arrangement sheet cutting device for cutting the wiring circuit board arrangement sheet for each line to improve safety of the cutting operation and replacing operation, even if a clearance between the wiring circuit boards is narrow, ensuring easier maintenance in view of suppressing maintenance cost, and moreover providing less possibility for reduction of quality of the wiring circuit board. SOLUTION: A sheet 3 on which a plurality of wiring circuit boards 2 are regularly arranged is placed on a sheet placing plate 31 (receiving plate 32) of a movable part 5, and the movable part 5 is then moved in the longitudinal direction sliding along a fixing part 4. Consequently, the sheet 3 can be cut for each line with a wire 20 of the fixing part 4. In this case, the sheet 3 can be cut for each line by reducing a diameter of the wire 20 even when a clearance is small between the wiring circuit boards 2. Moreover, the wire 20 is safer than a sharp rotating blade, and therefore safety of the cutting operation and replacing operation can be improved. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008034461(A) 申请公布日期 2008.02.14
申请号 JP20060203393 申请日期 2006.07.26
申请人 NITTO DENKO CORP 发明人 IWASAKI YUICHI;KATAOKA KOJI;MIZUSHIMA AYA
分类号 H05K3/00;B26D1/547 主分类号 H05K3/00
代理机构 代理人
主权项
地址