| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method wherein delamination is hardly caused between a conductor wiring layer and a ceramic layer, when a multilayer ceramic substrate, wherein a metal foil is used as the conductor wiring layer, is manufactured. <P>SOLUTION: The conductor wiring layer is constituted of the metal foil 11 containing Cu. A surface of the layer is coated with Cu<SB>2</SB>O, and a raw laminate 23 is manufactured and baked. As a result, laminate after sintering, which is used for a multilayer ceramic substrate, is obtained. Because the metal foil containing Cu is made to be a state covered with Cu<SB>2</SB>O, at least a part of the surface of the metal foil is preferably heat-treated in an oxidizing atmosphere. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
