| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit device wherein quality is improved such as heat dissipation characteristics. <P>SOLUTION: A groove 16 is formed in the undersurface of a circuit board 11 where a hybrid integrated circuit is built in onto the upper surface. A contact area increases by forming the groove 16 between the circuit board 11 and a sealing resin 14 for covering the undersurface of the circuit board 11. Therefore, the heat resistance decreases in the interface of the undersurface of the circuit board 11 and the sealing resin 14. By this way, the heat generated from circuit elements, such as a semiconductor device 15A, is favorably dissipated outside via the sealing resin 14 for covering the circuit board 11 and its undersurface. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
