| 发明名称 |
Electroless copper and redox couples |
| 摘要 |
Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
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| 申请公布号 |
US2008038449(A1) |
申请公布日期 |
2008.02.14 |
| 申请号 |
US20070825355 |
申请日期 |
2007.07.06 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
POOLE MARK A.;COBLEY ANDREW J.;SINGH AMRIK;HIRST DEBORAH V. |
| 分类号 |
B05D5/12 |
主分类号 |
B05D5/12 |
| 代理机构 |
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