| 摘要 |
PROBLEM TO BE SOLVED: To provide a modifier for composite materials having a good dissolvability of the modifier for composite materials into an acetic acid aqueous solution when preliminarily treating, gluing an inorganic reinforcing material strongly to an organic resin without curing strain, having a flexible and water-resistant adhesion surface thereof, and capable of producing a composite material excellent in solder heat resistance and heat shock characteristics even when turning into a laminate by making a thin layer. SOLUTION: The modifier for composite materials comprises an organosilicone compound as a principal agent prepared by reacting an amino-group-containing organosilicone compound represented by formula (1), where R<SP>1</SP>, R<SP>2</SP>are monovalent hydrocarbon groups, R<SP>3</SP>, R<SP>4</SP>are divalent hydrocarbon groups, p is 0, 1, or 2, and s is 0-3, with a vinyl benzyl halide containing 50-95 mass% of a para-vinyl substitute, and 5-50 mass% of an orth-vinyl substitute and/or a meta-vinyl substitute as isomers: (R<SP>1</SP>O)<SB>(3-p)</SB>(R<SP>2</SP>)<SB>p</SB>Si-R<SP>3</SP>-(NH-R<SP>4</SP>)<SB>s</SB>-NH<SB>2</SB>(1). COPYRIGHT: (C)2008,JPO&INPIT
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