发明名称 |
Chip module e.g. for smart card, has full trace of chip system which in part has hidden outer polymeric protective layer |
摘要 |
The chip (4) or module (2) for a smart card has a full trace of a chip system (3, 4, 5, 5a, 5b), which in part has a hidden outer polymeric protective layer (6). Each hidden part of the system has a trace of organic sections made of polymeric material. Each contact pads (4a) has external electrical connections (3) and connected from the organic material. |
申请公布号 |
DE102007033229(A1) |
申请公布日期 |
2008.02.14 |
申请号 |
DE20071033229 |
申请日期 |
2007.07.17 |
申请人 |
GIESECKE & DEVRIENT GMBH |
发明人 |
BUTZ, KLAUS;LAMLA, MICHAEL;WIREN, ARVID |
分类号 |
H01L23/532;G06K19/073;H01L23/29 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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