发明名称 Chip module e.g. for smart card, has full trace of chip system which in part has hidden outer polymeric protective layer
摘要 The chip (4) or module (2) for a smart card has a full trace of a chip system (3, 4, 5, 5a, 5b), which in part has a hidden outer polymeric protective layer (6). Each hidden part of the system has a trace of organic sections made of polymeric material. Each contact pads (4a) has external electrical connections (3) and connected from the organic material.
申请公布号 DE102007033229(A1) 申请公布日期 2008.02.14
申请号 DE20071033229 申请日期 2007.07.17
申请人 GIESECKE & DEVRIENT GMBH 发明人 BUTZ, KLAUS;LAMLA, MICHAEL;WIREN, ARVID
分类号 H01L23/532;G06K19/073;H01L23/29 主分类号 H01L23/532
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