METHOD AND SYSTEM FOR TRANSPORTING SUBSTRATE

摘要

A method and a system for transferring a substrate are provided to prevent a wafer from being damaged during a wafer transformation by applying an impact to a substrate container to align separated wafers. A substrate container is loaded on a load port(S10). An impact is applied to the substrate container so as to align semiconductor substrates before the semiconductor substrates are unloaded from the loaded substrate container(S50). After the substrate container is loaded on the load port, a door of the substrate container is removed as well as an alignment state with respect to the semiconductor substrates loaded in the substrate container is examined. The impact applying process is performed when the semiconductor substrates are not aligned. The alignment examination process determines whether a double error or a cross error is occurred. The double error indicates a state of which the semiconductor substrates are overlapped with each other while the cross error represents a state of which the semiconductor substrates are not received in the substrate container.