| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for stably supplying plasma treatment equipment with a fluorine compound containing oxygen having a property being easily polymerized at a room temperature, particularly tetrafluorofuran without substantially deteriorating the etching performance or the like of the fluorine compound, and to provide a plasma treatment method changing the fluorine compound containing oxygen supplied by such a method into a plasma and plasma-treating a substance to be treated. SOLUTION: In the method for supplying the plasma treatment equipment with the fluorine compound containing oxygen, a polymer is pyrolyzed consisting of repeating units represented by formula C<SB>4</SB>F<SB>4</SB>O, the fluorine compound is obtained containing oxygen represented by formula: C<SB>4</SB>F<SB>4</SB>O, and the plasma treatment equipment is supplied with the obtained fluorine compound containing oxygen. In the plasma treatment method, the plasma treatment equipment is supplied with the fluorine compound containing oxygen by the supplying method, the fluorine compound containing oxygen is changed into the plasma in the equipment, and the substance to be treated is plasma-treated. A manufacturing method for a semiconductor device uses the plasma treatment method. COPYRIGHT: (C)2008,JPO&INPIT
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